| 子阵单元轮廓 | 基板上的AMC | 盖板上的FSS | 馈电 贴片 | 寄生 贴片 |
| R =45.0 | PAMC=5.9 | PFSS =5.3 | lf =9.7 | lp =9.1 |
| h =1 | d1,2,3 =2.8 | e1,2 =4.8 | wf =7.0 | wp =8.0 |
| hc =16.3 | d4 =3.0 | e3 =4.7 | fy =8.7 | lup =11.1 |
| hp =0.8 | d5 =3.2 | e4,5,6 =4.6 | dslot =3.2 | wup =18.0 |
| | | e7 =4.5 | ls =1.1 | doffset=1.4 |
| | | e8 =4.3 | ws =4.0 | |
| 性能 | 仿真 | 测试 |
| Gpeak (dBi) | 22.87 (9.6 GHz) | 22.51 (9.7 GHz) |
| hpeak (%) | 37.7 | 34.7 |
| BWcomm (GHz) | 9.38~10.33 (9.63 %) | 9.49~10.31 (8.28 %) |
| BWVSWR(GHz) | 9.33~10.42 | 8.99~11.53 |
| BWGain (GHz) | 9.38~10.33 | 9.46~10.73 |
| BWSLL (GHz) | 9.36~10.48 | 9.49~10.31 |
| HPBW (°) | 8.1~8.5 | 8.4~8.8 |
| SLL (dB) | -18 | -15 |
| X-PL (dB) | / | < - 30.0 dB |
| * HPBW-半功率主瓣宽度;X-PL-主瓣内交叉极化电平 | ||
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